Shining Point Industry Company

   The ceramic capillary  Tools from Die Attach to Wire Bonding. This includes Die Attach & Vacuum Pickup Tools, Flip Chip Tools and Semiconductor Wire Bonding Capillaries & Wedges. We offer standard designs as well as custom designs for customer specific packaging requirements and challenges.

   Dedicated and highly qualified sales and service engineers and application specialists ensure that customers receive professional service and support at all times from the design phase to starting mass production

   We can supply die pickup tools, wire bonding wedges, wire bonding capillaries, EFO wands, epoxy stamping and dispensing nozzles, capillary unplugging wires, ribbon wire bonding tools, TAB and Waffle bonding tools, die collets for active face die, peripheral edge pickup tools and a wide range of custom solutions is also available.